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XCKU025
XCKU025

XCKU025

Brand: XILINX

Package: BGA

Batch: 2117+

Inventory: 1250

Remarks:

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  • Overview
  • Specification
  • Technical documentation

KINTEX-KU product advantages

Kintex® UltraScale™ devices provide the best cost/performance/power ratio at the 20nm node, including the highest signal processing bandwidth in mid-range devices, next-generation transceivers, and low-cost packages to achieve the best combination of performance and cost-effectiveness. This series is suitable for packet processing for 100G network and data center applications, as well as the DSP-intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.

value Advantage
Programmable system integration
  • Up to 1.5M system logic unit, using 2nd generation 3D IC
  • Multiple integrated PCI Express® Gen3 cores
Improved system performance
  • 8.2 TeraMAC DSP computing performance
  • High utilization rate increases the speed by two levels
  • Each device has up to 64 transceivers with 16G backplane support.
  • 2,400Mb/s /DDR4 can work stably under different PVT conditions
BOM cost reduction
  • System integration reduces application BOM costs by up to 60%
  • The slowest 12.5 Gb/s transceiver
  • Mid-range speed grade chip can support 2,400 Mb/s DDR4
  • VCXO integration can reduce the cost of clock components
Total power consumption reduction
  • Up to 40% lower power consumption compared to the previous generation
  • Realize fine-grained clock gating function through UltraScale device ASIC-like clock
  • Enhanced system logic unit packaging reduces dynamic power consumption
Accelerate design productivity
  • Pin compatible with Virtex® UltraScale devices, high scalability
  • Co-optimize with Vivado® Design Suite to accelerate design closure

KINTEX-KU product list

    • Model
    • Logic Unit
    • DSP Slice
    • Memory (Kb)
    • 16.3Gb/s transceiver
    • Block RAM (Mb)
    • Maximum number of I/O pins

Technical documentation