VIRTEX-VU-P product advantages

Virtex® UltraScale+™ devices provide the highest performance and integrated functions on the 14nm/16nm FinFET node. Xilinx's third-generation 3D ICs use Stacked Silicon Interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the most stringent design requirements. It also provides registered inter-chip wiring, which can achieve operation greater than 600 MHz, has a rich and flexible clock, and can provide a virtual single-chip design experience. As the most powerful FPGA series in the industry, UltraScale+ devices are the perfect choice for computationally intensive applications: from 1+ Tb/s networks, machine learning to radar/warning systems.

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• 3D-on-3D integration
• Enhanced DSP core
• 32.75Gb/s transceiver
• Integrated block of PCI Express
• Memory
• ASIC level network IP